Principal Yield & Integration Engineer

Job Summary:

Under the general supervision of the Yield & Integration Engineering Manager, the Principal Yield & Integration Engineer is a technical leader responsible for driving yield improvement, process integration robustness, and defectivity reduction across advanced IR detection and thermal imaging device manufacturing operations. This role provides deep expertise in yield analysis, failure analysis, and progressed materials characterization, while leading cross-functional teams through complex yield excursion investigation, technology transfer, and new product introductions (NPI).

The individual will need to exhibit a self-driven sense of urgency, effective collaboration, tolerance of ambiguity, and demonstrated ability to exercise objective technical judgement while embracing the following responsibilities:

Roles and Responsibilities:

• Yield Ownership & Defectivity Reduction: Oversee wafer foundry yield management by establishing yield monitoring frameworks, analyzing inline, parametric, and final test data to identify yield loss mechanisms.
• Lead root cause investigations into yield excursions across fabrication, assembly, and test.
• Collaborate closely with foundry partners and internal process integration, device, and reliability teams to drive corrective actions, optimize process windows, and deliver sustained yield improvement and cost reduction.
• Analyze yield loss mechanisms impacting key detector metrics.
• Drive root cause analysis using advanced tools and techniques.
• Correlate physical defects to electrical, thermal, and optical performance impact.
• Own and optimize integrated process flows.
• Ensure compatibility and robustness across front-end, MEMS, and back-end processes.
• Support technology transfers and manufacturing ramp of new IR detector designs.
• Correlate process data with thermal imaging performance metrics and test results.
• Perform advanced yield and performance analysis using JMP, Python, SQL, or MATLAB.
• Develop yield dashboards, defect Pareto analyses, and predictive indicators for yield risk.
• Partner closely with device design and modeling teams, ROIC and electronics engineering.
• Interact with reliability, packaging, and test engineering.
• Interface with equipment vendors, material suppliers, and external foundries on yield and integration issues.
• Support customer-facing root cause investigations and continuous improvement efforts.
• Mentor junior yield and integration engineers in IR-specific failure analysis and yield methodologies.
• Lead multi-disciplinary improvement projects using Lean and Six Sigma tools.
• Define best practices, documentation standards, and yield control plans for manufacturing.

Qualifications:

• Familiarity with electronic circuit functionality (schematics, functional elements, etc.).
• Microbolometer MEMS fabrication.
• Insight to wafer foundry functionality and process integration.
• Vacuum technology: concepts, materials, and equipment.
• Familiarity with photolithography processes and equipment.
• ROIC-to-detector hybridization.
• Wafer bonding, dicing, and release steps.
• Strong understanding of MEMS processing, thin films, and wafer-level integration, including photolithography, wafer photo pattern strips & cleans, CMP, etch, lift-off, PECVD, PVD, and E-Beam.
• Expertise in SPC, DOE, and yield analytics.
• Hands-on experience with AOI, SEM, EDX, FIB, FTIR.
• Strong data-driven decision-making and mentorship capabilities.
• Exceptional root cause analysis and system-level thinking.
• Strong written and verbal communication.
• Ability to lead technically across organizations without direct authority.

Required Qualifications:

• M.S. or equivalent in a STEM field. Will consider equivalent work experience.
• 7+ years of experience in yield engineering, process integration, or device engineering.
• Direct experience with infrared detectors, thermal imaging systems, microbolometers, or MEMS devices.
• Must be US Citizen or PERM Resident.

Preferred Qualifications:

• Familiarity with vacuum packaging, wafer bonding, and hermetic sealing.
• Prior ownership of an IR technology node or product family.
• Six Sigma Green Belt or Black Belt certification.

Salary Range:

$177,500.00-$236,600.00

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.