IC Packaging Engineer
Axiado
Full Time10+ yearsPosted 4 days ago
Let the right jobs find you
Get personalised suggestions from verified company career pages, matched to your role, location, level, and skills.
Overview
Position Type
Full Time
Experience
10+ years
Job Description
Job Description
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. This role is designed for a senior technologist who combines deep hands-on expertise with system-level thinking, and who thrives in high-ambiguity, high-impact settings.
Key Responsibilities
- Serve as technical authority for IC and SiP packaging across multiple products and programs.
- Own package architecture and technology roadmap, aligned with product, cost, and scalability goals.
- Lead chiplet-based packaging strategies, including UCIe, silicon interposers, and advanced RDL.
- Perform and guide hands-on package design and physical layout, including critical structures for High-speed SerDes/PHY (PCIe, CXL), LPDDR5, UCIe, and Other multi-gigabit interfaces.
- Define substrate stack-ups, materials, bump/RDL architectures, and DFM guidelines for advanced nodes.
- Drive SI/PI, thermal, mechanical, and reliability trade-offs at the system and package levels.
- Lead external engagement with OSATs, foundries, and key suppliers for technology development and manufacturing readiness.
- Influence product roadmap, risk management, and investment decisions through technical insight.
- Establish scalable design methodologies, best practices, and reusable packaging flows.